Atrenne Brings Electronic Packaging Expertise to Open Compute Project

BROCKTON, Mass., Dec. 5, 2016 – Atrenne Integrated Solutions, Inc., a global leader in design and manufacturing of complex electronic packaging systems for demanding applications, today announced that the company has joined the Open Compute Project (OCP) as a Community level member.  Launched in 2011, OCP applies community-oriented, open source principles to IT and enterprise data center infrastructure designs.

Atrenne plans to participate in the OCP server and networking projects. Atrenne will apply its 40+ year expertise in system-level design and engineering to the life-cycle cost and energy consumption challenges facing today’s IT and network equipment architects.  

“Atrenne is pleased to join the collaborative OCP community,” said Mark Medeiros, Vice President Commercial & Industrial Systems.  “OCP provides compute and networking solution providers with a framework to collaborate on an unprecedented scale.  We are excited to partner with OCP community members to produce even more effective solutions.”

Please refer to the Atrenne web site for more information on our electronic packaging and other solutions expertise. Inquiries may be directed to our contact us page.

About OCP
The Open Compute Project Foundation is a 501(c) (6) organization which was founded in 2011 by Facebook, Intel, Rackspace. Our mission is to apply the benefits of open source to hardware and rapidly increase the pace of innovation in, near and around the data center and beyond.

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