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SFF Solution 760-92

Overview

The Small Form Factor (SFF) Solution 760-92 rugged electronic packaging design enables off-the-shelf Mini-ITX and PCIe commercial electronics CCA’s to be deployed in the SWAP and cost-constrained, harsh environments characteristic of ground mobile, naval and airborne applications. 

  • Specifications

    Product Features and Benefits
      • Dimensions: 11.22” L x 9.06” W x 3.43” H
      • Operating Temperature  : -32°C – 55°C
      • Storage Temperature: -40°C – 71°C
      • Weight: 13 lbs
      • Altitude: Well above 50,000 feet
      • Shock and Vibration: MIL-STD-810
      • Cooling: Baseplate conduction
      • Internal : Mini-ITX with 3 PCIe slots or similar
      • EMI: MIL-STD-461E
      • Power:  <100W, MIL-STD-704E

  • Downloads

    White Papers, Case Studies, Technical Information
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