Dates: September 22–24, 2026
Location: National Harbor, MD
Find us at: Booth 300
Event Website: MOSA 2026 Summit
As open architectures become the central driving force across defense programs, Atrenne is proud to showcase our next-generation rugged electronic packaging solutions at the 2026 MOSA Industry & Government Summit & Expo.
Applying a Modular Open Systems Approach (MOSA) requires hardware that is adaptable, upgradeable, and capable of surviving the harshest environments. Atrenne designs and manufactures the high-performance, SWaP-optimized (Size, Weight, and Power) enclosures necessary to make enterprise-wide modularity a reality.
Stop by Booth 300 to connect with our engineering team and get a hands-on look at our latest open-architecture solutions, including:
- VNX+ (VITA 90) 726 Series Chassis
- Air-Flow-Through (AFT) Chassis
- 3D-Printed Conduction-Cooled Chassis
Let’s Build the Future of Open Architecture Together
Whether you are looking to streamline your acquisition process, embed modularity across your programs, or solve complex thermal management challenges, Atrenne is your trusted partner.