Atrenne Technical Overview

How well the commercial off-the-shelf (COTS) technologies, components, and solutions work together and with other systems determines how well the system works. Single-Board Computers (SBCs), Digital Signal Processing (DSP) boards, graphics systems, radar processing boards, signal acquisition systems, and more must all connect to advanced backplanes optimized to support the latest networking standards. They must also be packaged in chassis and enclosures for rugged, high-performance application needs.

Because this step is important to the growth and deployment process, you can only settle for the best. You need backplane and packaging choices that have been tried and tested, are built to the highest standards, and will work with your highly engineered-system.

The Atrenne Computing Solutions team has more than 50 years of experience providing advanced backplane, chassis, and packaging solutions for high-performance, rugged uses worldwide. We have the knowledge and skills to meet even the most difficult packaging needs. Whether your problems are with thermal management, high-speed backplane signal integrity, mechanical considerations, shock and vibration, size, weight, and power (SWaP) constraints, or meeting mil-standards, our team can engineer and develop a solution that lowers development and non-recurring expenditure (NRE) costs, reduces program time, and improves quality.