Our knowledgeable engineering team accelerates your time-to-market.

Design and Engineering

Design and engineering can distinguish between a product that makes it to market and one that defines the market. Our technical depth in design and engineering and engineering resources from Celestica help you to launch your innovative products faster than your competition.

Computing Solutions

Our computing solutions team designs and manufactures rugged electronic packaging, backplanes, and integrated assemblies for mission and performance-critical embedded computing platforms deployed in harsh environments.

Mechanical Solutions

Our mechanical solutions team designs and manufactures innovative engineered front panels, extruded aluminum enclosures, PCI brackets and ruggedized packaging for circuit board mounting and assembly systems.

Systems Integration

We offer complete system integration services for both open architecture systems and application-specific requirements.

Thermal Management

We deliver a full spectrum of thermal engineering services, from concept development through product design to high-volume production of a fully integrated thermal management solution.

Signal Integrity Analysis

Atrenne offers electronic hardware design team services based on decades of signal integrity (SI) experience. Our advanced SI designs deliver reliable Gen-4/5 @ 16/25 Gbaud operation, focusing on high-speed data throughput, and use extensive simulation capabilities to ensure that designs perform correctly, every time.


White Paper Designing SOSA™ Backplanes for the Future of Electronics

Backplane signal integrity is an emerging issue for new SOSA™ systems. The issue isn’t caused by the standard; it arises because new systems must be able to operate at very high data signaling rates to keep pace with exploding volumes of sensor-generated data. This paper will focus on a specific technical topic, signal integrity, leaving the discussion of planning and acquisition top­ics to other forums.

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