BROCKTON, Mass., Oct. 25, 2016 – Atrenne Integrated Solutions, Inc. announced an extension to the Small Form Factor (SFF) 760 Series electronic packaging design which enables off-the-shelf Mini-ITX and PCIe commercial electronics CCA’s to be deployed in airborne applications that reach stratospheric altitudes, well above 50,000 feet. Commercial components are typically not designed to operate in reduced pressure environments. For example, standard aluminum electrolytic capacitors, are designed for atmospheric pressure corresponding to 10,000 feet and below.
Atrenne created a hermetically sealed rugged enclosure which maintained an atmospheric pressure of one atmosphere at all times, essentially simulating a lab operating environment. In order to maintain a seal, Atrenne employed a gasket able to buffer mechanical occlusions between the two precisely machined aluminum surfaces of the enclosure. Atrenne also developed a creative solution to maintain a seal around fiber optic cables, I/O cables and connectors.
“A technology integrator presented us with a design challenge and our engineers were able to step up and find an innovative solution,” stated Steve Orsini, Director of Program Management, Atrenne Integrated Solutions. “Atrenne has deep domain expertise in mechanical design, thermal management, I/O conditioning and lean manufacturing. We brought all of our capabilities to bear to solve this extremely difficult technical challenge.”
The solution also incorporated workmanship standards, and design for vibration, shock, and temperature. With a robust enclosure design, the system was able to meet stringent application requirements by isolating sensitive internal electronics from the harsh external environment.