Press Release

Atrenne Integrated Solutions Acquires Hybricon

MINNEAPOLIS, July 2, 2015 – Atrenne Integrated Solutions™ today announced that it has acquired substantially all assets of the Engineered Packaging business unit, formerly Hybricon®, from Curtiss-Wright Corporation (NYSE: CW). The Engineered Packaging business unit, effective immediately, is part of Atrenne Computing Solutions, a subsidiary of Atrenne Integrated Solutions.

With the addition of the Engineered Packaging business unit, Atrenne Integrated Solutions expands its market leadership in rugged, custom and Commercial-Off-The-Shelf (COTS) chassis and backplanes for defense, commercial and industrial markets. The acquisition will combine Hybricon’s leading high-speed signaling technology and extensive portfolio of field-proven enclosure designs with Atrenne’s leading electronic assemblies, front panels, extruded aluminum enclosures, card cages, integrally lit control panels, simulator components/assemblies, connectors, interconnects, specialty CCAs, and backplanes.

“We’re excited about adding the Engineered Packaging business unit and the Hybricon brand to our portfolio; this is significant for our company and customers,” said Jan Erik Mathiesen, Atrenne’s Chief Executive Officer. “The Hybricon brand has a solid reputation for delivering design and manufacturing solutions for high performance chassis and backplanes to its customers. This adds significant capabilities and scale to our enclosure business. We will be able to invest in high-potential market opportunities, ultimately delivering exciting new technologies to our customer base. This will improve efficiency, increase innovation and provide greater value to our defense and industrial customers.”

The Hybricon brand has been known for delivering the highest quality, industry leading signal integrity, best-in-class thermal management and meeting the most challenging qualification requirements. With nearly 40 years of designing and manufacturing a wide range of VITA/PICMG-standard compliant and rugged application-specific electronic packaging solutions, their products are deployed across defense, commercial and industrial markets.