Integrating VITA 67 RF Feed-Through Modules into 3U/6U VPX & OpenVPX Systems

In high-performance VPX and OpenVPX systems, managing RF signals and power distribution demands both mechanical precision and electrical reliability. The ANSI/VITA 67 family of standards—particularly VITA 67.1 (3U RF modules) and VITA 67.2 (6U RF modules)—defines blind-mate, board-to-backplane RF/analog interconnects that enable compact, side-by-side integration of up to 8 SMPM contacts in a single module. Atrenne’s hybrid backplane solution (PN 92-175) natively supports both 3U/6U slots and VITA 67.1/67.2 feed-through connectors, delivering a seamless path for RF signal routing and power feed in a single assembly.

1. Why VITA 67 Matters for Your VPX System

• High-Density RF Interconnects:
  VITA 67 modules pack eight sub-miniature push-on micro (SMPM) coax contacts into the footprint of a single 3U / 6U VPX data slot, ideal for applications requiring multiple high-frequency channels (e.g.,  C5ISR).
  
• Blind-Mate Reliability:
  The blind-mate design simplifies field assembly and maintenance—cabling automatically aligns and latches when the card is inserted, reducing mean time to repair (MTTR) in deployed systems.
  
• Side-by-Side Compatibility:
  VITA 67 modules coexist with other VITA connector families (VITA 46, and VITA 66.5 ), enabling mixed-signal systems without mechanical interference.

2. Common Integration Challenges

1. Mechanical Alignment & Slot Allocation:
   Ensuring that RF modules line up precisely with backplane cutouts while preserving airflow and structural rigidity.
   
2. Signal Integrity & Isolation:
   Avoiding crosstalk between high-speed data planes (e.g., 25 Gb/s fabrics) and RF lines requires controlled impedance and board-level shielding.
   
3. Power & Ground Distribution:
   Balancing RF feed-throughs with power planes without introducing ground loops or impedance shifts.
   
4. Thermal Management:
   Unmanaged heat is the enemy of performance and reliability in systems utilizing RF modules and power supplies. As these essential components operate, they inevitably generate thermal energy. Without effective dissipation, this heat can degrade signal quality, shorten component lifespan, and lead to outright system failure. Consequently, intelligent chassis and backplane design is paramount, serving as the primary defense against the detrimental effects of heat.

3. Atrenne’s 92-175 Hybrid OpenVPX Backplane Solution

Atrenne’s Backplane Solution 92-175 is engineered to address these challenges head-on:

• Hybrid 3U/6U Slots:
  – 2× 6U OpenVPX slots with VITA 67.1 and 67.2 feed-through cutouts
  – 6× 3U OpenVPX slots for data and utility modules
  
• Precision RF Cutouts:
  – Factory-machined apertures sized for SMPM RF coax connectors
  – Blind-mate retention features for secure mating under shock and vibration
  
• Integrated VPX+ Rear Transition Module (RTM) Connectivity:
  – VPX+ RTM connectors route both data and RF/power lines cleanly to rear modules
  
• Custom Fabric Topology:
  – Tailored data-plane and utility-plane traces to optimize signal integrity alongside RF feed-throughs
  
• Thermal & Mechanical Robustness:
  – 0.212″ board thickness for rigidity and controlled impedance
  – Operating range: 0 to +30 °C (standard); extended temperature versions available
  

Learn more & download the datasheet:
3U/6U OpenVPX VITA 67.1 & 67.2 RF Backplane (PN 92-175) Datasheet »

4. Best Practices for Integration

1. Plan Slot Mapping Early:
   Reserve contiguous 6U slots for VITA 67.2 modules to simplify cable harness routing.
   
2. Maintain Ground Continuity:
   Use dedicated ground planes adjacent to RF cutouts; implement via stitching around connector areas.
   
3. Optimize Cable Harnesses:
   Specify high-flex SMPM coax assemblies of appropriate length; bundle and label them for ease of service.
   
4. Coordinate with Chassis Design:
   Ensure the ATR or rackmount enclosure supports onboard heat sinks for both RF modules and adjacent power supplies.
   
5. Validate with Prototypes:
   Build a preliminary backplane‐RTM stack in Atrenne’s rapid prototyping lab to verify mechanical tolerances and signal integrity before full-scale production.
   

5. Real-World Applications

• ISR &  Electromagnetic Dominance:
  Multiple wideband RF channels for signal collection and jamming efforts.
  
• Radar & Communications:
  Seamless integration of high-frequency transceiver modules alongside digital signal processors.
  
• Test & Measurement:
  Compact systems requiring both high-speed data capture and precise RF feed-throughs in portable ATRs.
  

Streamline RF Integration with Atrenne’s Turnkey 92-175 Backplane

Integrating VITA 67.2 RF feed-through modules into VPX and OpenVPX systems no longer needs to be a complex, custom effort. Atrenne’s hybrid 3U/6U Backplane Solution 92-175 delivers a proven, turnkey platform—complete with precision RF cutouts, rugged mechanical design, and seamless data-plane integration—so you can deploy mission-critical systems faster and with greater confidence.

Ready to streamline your next VPX build?
Request Info on PN 92-175, or contact Atrenne’s engineering team to discuss a tailored solution.